Excess moisture can occur for a variety of reasons. Two possible causes are rising and penetrating moisture. Rising moisture occurs when water from the ground seeps into the foundation of a building and rises vertically up through porous building material such as brick or stone. This usually happens due to lack of a waterproofed foundation or damage to the building’s moisture-course. A moisture-course is an impermeable, waterproof material laid on the foundation just above ground to prevent moisture from traveling up the walls of a building. As rising moisture describes the vertical movement of moisture, penetrating moisture describes the lateral movement of moisture and dampness. Penetrating moisture can occur both underground and above ground. Underground penetration occurs when moisture from the ground infiltrates the walls of an underground room. This type of moisture usually occurs in basements or cellars. Above ground penetrating moisture is usually caused by structural defects or poor building maintenance. This type of moisture often occurs in wall and ceiling cavities and can be caused by maintenance and building issues such as a leaky roof or dripping pipes. All of these different sources of moisture intrusion can lead to issues with Indoor Air Quality. Some indications of building moisture problems include decorative damage, such as peeling paint, bubbling wall paper, and general discoloration, however, these simple and unattractive signs can indicate much more serious and unseen problems. With any type of excess moisture there is an increased risk of structural damage, dry rot, and especially microbial contamination such as mold. Whenever there has been dampness or excess moisture in a building for more than 24 hours, there is an increased risk of microbial contamination. Hidden mold contamination in walls and building foundations can cause not only costly damage but have possible health effects as well. For more information on moisture issues, please visit Aerotech Laboratories, Inc.
First Published: Late-October 2003 .................................................. .................................................. .................................................. ..................................................
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